THERMOSETTING COMPOSITION

• Main Authors: ARII KENJI, SOGAME MASANOBU, FUKASAWA EMI, MABUCHI YOSHINORI, OHTSUKA HAJIME
• Format: Patent
• Language: English; Korean
• Published: 10.07.2013
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

There is provided a resin composition that can allow a drying step after impregnation coating of a prepreg and lamination pressing to be performed at low temperatures in a short time and, at the same time, can maintain storage stability of the prepreg. The resin composition according to the present invention comprises (A) an imidazole compound represented by formula (I), (B) an epoxy compound, and (C1) a cyanate compound or (C2) a BT resin. In the formula, R 1 and R 2 each independently represent an alkyl group having 3 to 18 carbon atoms, an alkenyl group having 3 to 18 carbon atoms, an alkoxyl group having 3 to 18 carbon atoms, or a substituted or unsubstituted aromatic substituent having 6 to 14 carbon atoms; and R 3 represents hydrogen, an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms, a substituted or unsubstituted aromatic substituent having 6 to 14 carbon atoms, or a halogen group.