APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

PURPOSE: An apparatus and a method for processing a substrate are provided to reduce the damage and breakage by using a fixing type support pin to hold a substrate. CONSTITUTION: A chamber provides a space for processing a substrate. Support pins (40) are fixed to the space of the chamber. The suppo...

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Bibliographic Details
Main Author KANG, JAE SUNG
Format Patent
LanguageEnglish
Korean
Published 10.07.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An apparatus and a method for processing a substrate are provided to reduce the damage and breakage by using a fixing type support pin to hold a substrate. CONSTITUTION: A chamber provides a space for processing a substrate. Support pins (40) are fixed to the space of the chamber. The support pins support the substrate. An upper electrode assembly (20) is arranged on the upper part of the support pin. A lower electrode assembly (30) is arranged on the lower part of the support pin.
Bibliography:Application Number: KR20110147840