COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING

• Main Authors: SAKAI MAKOTO, SAITO MUTSUKO, HAYASHI SHINJIRO, MORINAGA TOSHIYUKI
• Format: Patent
• Language: English; Korean
• Published: 05.07.2013
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

PURPOSE: A copper electroplating solution and a copper electroplating method are provided to decrease via charging performance and the effect of a compound having a structure of -X-S as a composition product of a sulfur-contained compound by the copper electroplating solution containing ninhydrin and the sulfur-contained compound. CONSTITUTION: A copper electroplating solution has a structure of -X-S-Y-. The X and Y are composed of an atom selected among hydrogen, carbon, sulfur, nitrogen, and oxygen. The X and Y can be same only in case of carbon. [Reference numerals] (AA) Voltage (V); (BB) Detention time (second)