COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING

PURPOSE: A copper electroplating solution and a copper electroplating method are provided to decrease via charging performance and the effect of a compound having a structure of -X-S as a composition product of a sulfur-contained compound by the copper electroplating solution containing ninhydrin an...

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Main Authors SAKAI MAKOTO, SAITO MUTSUKO, HAYASHI SHINJIRO, MORINAGA TOSHIYUKI
Format Patent
LanguageEnglish
Korean
Published 05.07.2013
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A copper electroplating solution and a copper electroplating method are provided to decrease via charging performance and the effect of a compound having a structure of -X-S as a composition product of a sulfur-contained compound by the copper electroplating solution containing ninhydrin and the sulfur-contained compound. CONSTITUTION: A copper electroplating solution has a structure of -X-S-Y-. The X and Y are composed of an atom selected among hydrogen, carbon, sulfur, nitrogen, and oxygen. The X and Y can be same only in case of carbon. [Reference numerals] (AA) Voltage (V); (BB) Detention time (second)
Bibliography:Application Number: KR20120154953