RESIN COMPOSITION FOR FIXING A LEAD OF SEMICONDUCTOR AND THE TAPE FOR FIXING A LEAD

PURPOSE: A resin composition for fixing a semiconductor lead is provided to offer high temperature attachment and high voltage reliability, and to improve heat-proof resistance and physical rigidity by increasing the crosslinking density of an adhesive. CONSTITUTION: A resin composition for fixing a...

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Bibliographic Details
Main Authors SHIN, JAE HAN, UHM, TAI SOO, CHA, SE YOUNG, JEON, HAE SANG
Format Patent
LanguageEnglish
Korean
Published 05.07.2013
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:PURPOSE: A resin composition for fixing a semiconductor lead is provided to offer high temperature attachment and high voltage reliability, and to improve heat-proof resistance and physical rigidity by increasing the crosslinking density of an adhesive. CONSTITUTION: A resin composition for fixing a semiconductor lead contains an epoxy resin, a curing agent, a thermoplastic resin, an additive, and a phosphorus compound denoted by chemical formula 1. In the chemical formula 1, R1-R15 are the same or different, and are independently H or a C1-6 alkyl group. A lead fixing tape using the resin composition for fixing the semiconductor lead is obtained by coating the resin composition on a supporting base film, and laminating a protective film on the coated composition.
Bibliography:Application Number: KR20110143101