LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE PACKAGE

PURPOSE: A light emitting device and a light emitting device package are provided to prevent a pad from being separated in a wire bonding process by forming an ohmic contact layer to cover the pad on a light emitting structure. CONSTITUTION: A light emitting structure (135) includes a first conducti...

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Bibliographic Details
Main Authors HWANG, SON KYO, PARK, BUM DOO
Format Patent
LanguageEnglish
Korean
Published 05.07.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A light emitting device and a light emitting device package are provided to prevent a pad from being separated in a wire bonding process by forming an ohmic contact layer to cover the pad on a light emitting structure. CONSTITUTION: A light emitting structure (135) includes a first conductive semiconductor layer (110), an active layer (120), and a second conductive semiconductor layer (130). A support member (170) is located under the light emitting structure. A first electrode (115) is formed on the light emitting structure. An ohmic contact layer (194) covers the first electrode and the upper side of the light emitting structure. A current blocking layer (145) is formed under the second conductive semiconductor layer.
Bibliography:Application Number: KR20110136827