LASER MACHINING APPARATUS

PURPOSE: A laser processing device is provided to correct the dislocation of an irradiation position of laser beam oscillated from a laser beam oscillator. CONSTITUTION: A laser processing device comprises a stop base(2), a chuck table device(3), a laser beam irradiation unit support device(4), and...

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Bibliographic Details
Main Author MORIKAZU HIROSHI
Format Patent
LanguageEnglish
Korean
Published 28.06.2013
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: A laser processing device is provided to correct the dislocation of an irradiation position of laser beam oscillated from a laser beam oscillator. CONSTITUTION: A laser processing device comprises a stop base(2), a chuck table device(3), a laser beam irradiation unit support device(4), and a laser beam irradiation unit(5). The chuck table device maintains processing object by being movably installed in a processing transfer direction. The laser beam irradiation unit support device is movably installed in an indexing transfer direction. The laser beam irradiation unit is movably installed in a control direction of a light collecting point which is displayed with an arrow on the laser beam irradiation unit support device.
Bibliography:Application Number: KR20120141751