BASE FOR OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR PREPARING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE

PURPOSE: A base for an optical semiconductor device and a manufacturing method thereof, and an optical semiconductor device are provided to dissipate heat generated from a semiconductor chip through a chip mounting portion efficiently. CONSTITUTION: A metal frame (4) has a plurality of chip mounting...

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Bibliographic Details
Main Authors SHIOBARA TOSHIO, FUKASAWA HIROYUKI, GOTO WATARU
Format Patent
LanguageEnglish
Korean
Published 26.06.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A base for an optical semiconductor device and a manufacturing method thereof, and an optical semiconductor device are provided to dissipate heat generated from a semiconductor chip through a chip mounting portion efficiently. CONSTITUTION: A metal frame (4) has a plurality of chip mounting parts (2) and a plurality of signal connection parts (3). The plurality of chip mounting parts is mounted with a semiconductor chip. The plurality of signal connection parts is electrically connected to the semiconductor chip. The plurality of signal connection parts provides an electrode part to the outside. A resin part (5) is buried in a part except the plurality of chip mounting parts and the plurality of signal connection parts.
Bibliography:Application Number: KR20120145056