INTERPOSER, CIRCUIT BOARD MODULE, AND METHOD FOR MANUFACTURING INTERPOSER

• Main Author: MORIYA YASUO
• Format: Patent
• Language: English; Korean
• Published: 26.06.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

PURPOSE: An interposer, a printed circuit board module, and an interposer manufacturing method are provided to form multiple electrode structures which have flexibility in a lump without adding a special structure. CONSTITUTION: An interposer(10) is arranged between a semiconductor device(30) and a printed circuit board(20). The interposer includes multiple spring electrodes(12), a base material(14), an electrode pad(22), and an electrode(32). The multiple spring electrodes are fixed in the base material in a fixed arrangement. The spring electrode has an upper pad(12a), a lower pad(12b), and a post(12c). The post connects one end of the first pad with one end of the second pad. [Reference numerals] (10) Interposer; (12) Spring electrode; (12a) Upper pad; (12b) Bottom pad; (12c) Post; (14) Base material; (20) Printed circuit board; (22) Electrode pad; (30) Semiconductor device; (32) Electrode