LIGHT EMITTING DEVICE MODULE AND MANUFACTURING METHOD THEREOF, AND BACKLIGHT DEVICE

• Main Authors: ISHIO TOSHIYA, TANAKA YASUHIKO
• Format: Patent
• Language: English; Korean
• Published: 18.06.2013
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

PURPOSE: A light emitting device module, a manufacturing method thereof, and a backlight device are provided to restrain the generation of cracks or exfoliation in an optical lens and a substrate due to thermal expansion, and to improve the throughput of the light emitting device module. CONSTITUTION: A light emitting device component(2) is electrically connected to a component substrate(3). An optical lens(21) disperses light from a light emitting device. The optical lens is fixed to a substrate(11) by using an adhesive resin(31). The optical lens includes a lens part(22), a pillar part(23), a recess part(24), and a mark part(25). The pillar part disperses stress applied to an adhesive part due to the mismatch of the coefficient of thermal expansion of the optical lens.