METALLIC PASTE COMPOSITION FOR FORMATION OF AN ELECTRODE COMPRISING AG-COATED POWDERS AND ELECTRODES USING THE SAME

PURPOSE: A metallic paste composition for forming an electrode is provided to prevent degradation of electrical performance and physical performance regardless of decreasing silver content. CONSTITUTION: A metallic paste composition for forming an electrode comprises 20-60 wt% of plate type silver p...

Full description

Saved in:
Bibliographic Details
Main Authors KIM, SOO HEON, HWANG, BO CHUL, PARK, JAE KUK
Format Patent
LanguageEnglish
Korean
Published 04.06.2013
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
INSULATORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A metallic paste composition for forming an electrode is provided to prevent degradation of electrical performance and physical performance regardless of decreasing silver content. CONSTITUTION: A metallic paste composition for forming an electrode comprises 20-60 wt% of plate type silver powder(100); 0.1-25 wt% of plate type copper, nickel, or aluminum powder(200) coated with the silver; 5-20 wt% of organic vehicles; and 10-60 wt% of solvent. The silver powder has an average particle size of 5-20 um and a thickness of 500 nm or less. The copper, nickel, or aluminum powder has an average particle size of 5-30 um and a thickness of 1 um or less.
Bibliography:Application Number: KR20110124090