OPTICAL DEVICE WAFER PROCESSING METHOD

PURPOSE: A method for processing an optical device wafer is provided to prevent damage to a base substrate by separating an epitaxial substrate from the base substrate. CONSTITUTION: A base substrate is maintained on the chuck table of a laser processing apparatus. The base substrate is boned to an...

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Bibliographic Details
Main Author MORIKAZU HIROSHI
Format Patent
LanguageEnglish
Korean
Published 03.06.2013
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: A method for processing an optical device wafer is provided to prevent damage to a base substrate by separating an epitaxial substrate from the base substrate. CONSTITUTION: A base substrate is maintained on the chuck table of a laser processing apparatus. The base substrate is boned to an optical device wafer(10). A pulsed laser beam is irradiated. The pulsed laser beam penetrates an epitaxial substrate(11). The pulsed laser beam is absorbed by a buffer layer(13).
Bibliography:Application Number: KR20120129476