THE LIGHT EMITTING DEVICE PACKAGE, THE METHOD FOR MANUFACTURING THE SAME AND THE LIGHT EMITTING SYSTEM

PURPOSE: A light emitting device package, a method for manufacturing the same and a light emitting system are provided to prevent the warpage of a body by forming a lateral support part on a lead frame. CONSTITUTION: A body(210) includes a first lateral part and a second lateral part which is longer...

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Bibliographic Details
Main Author KIM, GAM GON
Format Patent
LanguageEnglish
Korean
Published 23.04.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A light emitting device package, a method for manufacturing the same and a light emitting system are provided to prevent the warpage of a body by forming a lateral support part on a lead frame. CONSTITUTION: A body(210) includes a first lateral part and a second lateral part which is longer than the first lateral part. A cavity(215) is formed in the upper surface of the body. A lateral groove(212) is formed in the second lateral part. A first lead frame(231) is separated from a second lead frame(232) in the cavity. A light emitting device(120) is arranged in the cavity. A wire connects electrically the lead frames to the light emitting device.
Bibliography:Application Number: KR20110104676