THE LIGHT EMITTING DEVICE PACKAGE, THE METHOD FOR MANUFACTURING THE SAME AND THE LIGHT EMITTING SYSTEM
PURPOSE: A light emitting device package, a method for manufacturing the same and a light emitting system are provided to prevent the warpage of a body by forming a lateral support part on a lead frame. CONSTITUTION: A body(210) includes a first lateral part and a second lateral part which is longer...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
23.04.2013
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A light emitting device package, a method for manufacturing the same and a light emitting system are provided to prevent the warpage of a body by forming a lateral support part on a lead frame. CONSTITUTION: A body(210) includes a first lateral part and a second lateral part which is longer than the first lateral part. A cavity(215) is formed in the upper surface of the body. A lateral groove(212) is formed in the second lateral part. A first lead frame(231) is separated from a second lead frame(232) in the cavity. A light emitting device(120) is arranged in the cavity. A wire connects electrically the lead frames to the light emitting device. |
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Bibliography: | Application Number: KR20110104676 |