ELECTRONIC COMPONENT MOUNTING APPARATUS, ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD

PURPOSE: An electronic component mounting apparatus, an electronic component mounting system, and an electronic component mounting method are provided to control an electronic component supply device with a plurality of lanes corresponding to a component tape to maintain the electronic component. CO...

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Bibliographic Details
Main Author ATSUMI TADASHI
Format Patent
LanguageEnglish
Korean
Published 22.04.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: An electronic component mounting apparatus, an electronic component mounting system, and an electronic component mounting method are provided to control an electronic component supply device with a plurality of lanes corresponding to a component tape to maintain the electronic component. CONSTITUTION: An electronic component supply unit(14) includes a first supply device(30) and a second supply device(32). The first supply device includes a plurality of lanes(31). The plurality of lanes supply an electronic component maintaining member to maintain a plurality of electronic components(9). The second supply device includes a singular lane. A head(15) mounts the electronic component supplied from the first supply device on a substrate(8). The control device controls the electronic component supply unit based on errors of the lane.
Bibliography:Application Number: KR20120112580