ELECTRONIC COMPONENT MOUNTING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD

• Main Authors: IKEBE HITOSHI, SATO YUSUKE, TAKAHASHI MASATO, FUJIMOTO KAZUYA, TAKAHASHI HIROSHI, KOBAYASHI HITOSHI, KODAMA YUSUKE, SAITO AKARI, SATO YOSHITAKA
• Format: Patent
• Language: English; Korean
• Published: 17.04.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; PRINTED CIRCUITS; TESTING

PURPOSE: An electronic component mounting apparatus and an electronic component mounting method are provided to accurately arrange electronic components on a substrate having a through hole. CONSTITUTION: An electronic component mounting apparatus supplies an electronic component(80) having a lead line. A head main body(30) includes a head supporter(31), a nozzle(32), and a nozzle driving part(34). The nozzle adsorbs the electrical component supplied from the electronic component mounting apparatus. A photographing device(36) is fixed to the head supporter and photographs a substrate. A laser recognition apparatus(38) includes a light source(38a) and a light receiving element(38b). A control unit(60) controls the head main body, the photographing device, and the component support unit. [Reference numerals] (60) Control unit; (62) Head control unit; (64) Component supply control unit; (AA) Z axis direction; (BB) Y axis direction;