HEAT-ADHERENT FILM AND PRESSURE-SENSITIVE ADHESIVE TAPE

PURPOSE: A thermal adhesive film is provided to obtain enough workability, reworkability, and strong adhesion force, and to maintain a film shape in a non-carrier state. CONSTITUTION: A thermal adhesive film comprises a polymer with a urethane group, amide group, and acrylic group. The thermal adhes...

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Bibliographic Details
Main Authors IMOTO EIICHI, NAKANISHI TADATOSHI
Format Patent
LanguageEnglish
Korean
Published 11.04.2013
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:PURPOSE: A thermal adhesive film is provided to obtain enough workability, reworkability, and strong adhesion force, and to maintain a film shape in a non-carrier state. CONSTITUTION: A thermal adhesive film comprises a polymer with a urethane group, amide group, and acrylic group. The thermal adhesive film maintains a film shape not having a substrate, at 25 deg. C. The tensile storage elasticity at -50 deg. C is 1.00X10^8 Pa or more and the tensile storage elasticity at 60 deg. C is 1.00X10^8 Pa or less, ordinary-state adhesion to a SUS304BA plate at 23.0+/-3.0 deg. C is 1.0 N/10mm or less, a room temperature adhesion to a SUS304BA plate at 60 deg. C is two times or more of the ordinary-state adhesion.
Bibliography:Application Number: KR20120109617