DIE BONDER AND SEMICONDUCTOR MANUFACTURING METHOD

PURPOSE: A die bonder and a semiconductor manufacturing method are provided to accurately correct a bonding location by detecting an offset based on a reference member near a bonding stage. CONSTITUTION: A die bonding unit includes a bonding location correcting device(50). A dislocation detecting un...

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Bibliographic Details
Main Authors KISHI YOSHIAKI, KIHARA MASAMICHI
Format Patent
LanguageEnglish
Korean
Published 08.04.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A die bonder and a semiconductor manufacturing method are provided to accurately correct a bonding location by detecting an offset based on a reference member near a bonding stage. CONSTITUTION: A die bonding unit includes a bonding location correcting device(50). A dislocation detecting unit(20) detects a bonding dislocation. A control unit controls a location determining device(60). A bonding head(41) bonds a die on the collet of the leading end. A substrate location detecting camera(42) detects the location of the lead frame.
Bibliography:Application Number: KR20130025706