PRINTED CIRCUIT BOARD AND A MANUFACTURING METHOD FOR THE SAME

PURPOSE: A PCB(Printed Circuit Board) including a metal post and a PCB manufacturing method are provided to increase reliability for connection with a semiconductor chip by obtaining a combination area with a solder ball. CONSTITUTION: A pad is formed on a substrate(110). A conductive post(114) is f...

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Bibliographic Details
Main Author MOK, JEE SOO
Format Patent
LanguageEnglish
Korean
Published 03.04.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: A PCB(Printed Circuit Board) including a metal post and a PCB manufacturing method are provided to increase reliability for connection with a semiconductor chip by obtaining a combination area with a solder ball. CONSTITUTION: A pad is formed on a substrate(110). A conductive post(114) is formed on the pad. A first solder resistance layer(120) exposes the conductive post which is formed at a lower height than the conductive post of the substrate. A second solder resistance layer(140) exposes the conductive post by forming a passing through hole of a large diameter. A surface processing layer(150) is formed at the conductive post.
Bibliography:Application Number: KR20110097113