TAPE ADHESION DEVICE AND TAPE ADHESION METHOD

• Main Author: YAMADA SHINGO
• Format: Patent
• Language: English; Korean
• Published: 25.03.2013
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CRYPTOGRAPHY; CURRENT COLLECTORS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; LABELS OR NAME-PLATES; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; PRINTED CIRCUITS; SEALS; SIGNS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge part of a board, an attaching step in which the conductive tape pieces is attached onto the attachment region of a first press position, and a moving step, in which by driving a tape sending mechanism to perform the operation of sending the tape member while a press bonding head and a peeling unit are integrally moved relative to the board, the press bonding head is aligned with the attachment region of a second press position, and a separator is peeled from the tape member attached onto the first press position by the peeling unit during the relative movement, are repeated.