POWER MODULE AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A power module and a method for manufacturing the same are provided to prevent the strength degradation of a binding part and the damage of an insulating substrate. CONSTITUTION: A line pattern(5) is formed in the surface of a substrate(3). A semiconductor device is mounted on the substrate...

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Bibliographic Details
Main Authors HIYOSHI MICHIAKI, YOKOZUKA TAKEHIDE, MURAMOTO AKIHIRO, YOSHIDA ISAMU
Format Patent
LanguageEnglish
Korean
Published 08.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A power module and a method for manufacturing the same are provided to prevent the strength degradation of a binding part and the damage of an insulating substrate. CONSTITUTION: A line pattern(5) is formed in the surface of a substrate(3). A semiconductor device is mounted on the substrate. The semiconductor device is electrically connected to a part of the line pattern. A terminal part includes a lead(7). The lead is electrically connected to the line pattern.
Bibliography:Application Number: KR20120046863