METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PURPOSE: A method for manufacturing a semiconductor device is provided to suppress chippings by discharging grinding residues to the outside in a wafer grinding process. CONSTITUTION: A wafer(10) is ground by a grindstone(24) fixed to a grind wheel(22). The grindstone has an edge part(24a) and a bot...

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Bibliographic Details
Main Authors NAKATA KAZUNARI, MATSUMURA TAMIO
Format Patent
LanguageEnglish
Korean
Published 07.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PURPOSE: A method for manufacturing a semiconductor device is provided to suppress chippings by discharging grinding residues to the outside in a wafer grinding process. CONSTITUTION: A wafer(10) is ground by a grindstone(24) fixed to a grind wheel(22). The grindstone has an edge part(24a) and a bottom surface(24b). The grindstone alternatively moves in a parallel direction to an x-y plane and a z direction. An incline(25) and a thinned part(26) are formed on the wafer by a grinding process. A grinding residue(29) is discharged through a space between the incline and the grindstone. The grind wheel and the grindstone are rotated in an opposite direction to a stage(20).
Bibliography:Application Number: KR20120091608