PERFORATING METHOD AND LASER MACHINING APPARATUS

• Main Author: MORIKAZU HIROSHI
• Format: Patent
• Language: English; Korean
• Published: 07.03.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PURPOSE: A punching method and a laser machining apparatus are provided to control a laser beam irradiation tool, thereby preventing a second member from being fused even if plasma light is not properly generated by the irradiation of a laser beam. CONSTITUTION: A punching method includes: a minimum shot number setting process for setting the shot number of pulse laser beams into a minimum value at conversion time in which the spectrum of plasma by the irradiation of the laser beam changes from the specific spectrum of a first material into the specific spectrum of a second spectrum; a maximum shot number setting process for setting the shot number of the pulse laser beams into a maximum value at conversion time in which the spectrum of the plasma completely changes from the specific spectrum of the first material into the specific spectrum of the second spectrum; a step of punching process for counting the shot numbers of the pulse laser beams and measuring the specific spectrums of the materials from the plasma when laser machined holes are formed on the predetermined positions of a workpiece by irradiating the pulse laser beams from a first member; and a step of stopping the irradiation of the pulse laser beams when the shot number of the pulse laser beams reaches the minimum value so that the spectrum of the plasma can change from the specific spectrum of the first material to the specific spectrum of the second spectrum, or stopping the irradiation of the pulse laser beams after continuing the irradiation to the point where the shot number of the pulse laser beams reaches the maximum value when the spectrum of the plasma does not change from the specific spectrum of the first material to the specific spectrum of the second spectrum despite of the reaching the minimum value by the shot number of the pulse laser beams.