THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to simplify the manufacturing process of a substrate by performing plating processes for a surface treatment at a time. CONSTITUTION: A circuit pattern(125) and a pad(120) are formed on an insulating layer. A metal laye...

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Bibliographic Details
Main Authors JO, YUN KYOUNG, EOM, SAI RAN, PARK, CHANG HWA, LIM, SEOL HEE, KIM, AE RIM
Format Patent
LanguageEnglish
Korean
Published 05.03.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: A printed circuit board and a manufacturing method thereof are provided to simplify the manufacturing process of a substrate by performing plating processes for a surface treatment at a time. CONSTITUTION: A circuit pattern(125) and a pad(120) are formed on an insulating layer. A metal layer is formed on the circuit pattern or the pad. The metal layer comprises a first metal layer(130). The first metal layer is formed with a plating solution including at least one addition agent selected from alkyl sulfonate, alkyl sulfate, aryl sulfate and heteroaryl sulfate. A metal layer comprises a second metal layer(140) and a third metal layer(150). The second metal layer includes nickel. The third metal layer includes palladium.
Bibliography:Application Number: KR20110083297