SEMICONDUCTOR DEVICE TESTING SYSTEM

PURPOSE: A semiconductor package test system is provided to solve contact stability problems that can occur later on through secured data. CONSTITUTION: A structure of a semiconductor package test system comprises a package pressing part(100), a socket housing(300), a socket guide(200), and a stress...

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Bibliographic Details
Main Authors HWANG, SOON GEOL, SEO, HUN KYO, KIM, JANG SUN
Format Patent
LanguageEnglish
Korean
Published 27.02.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PURPOSE: A semiconductor package test system is provided to solve contact stability problems that can occur later on through secured data. CONSTITUTION: A structure of a semiconductor package test system comprises a package pressing part(100), a socket housing(300), a socket guide(200), and a stress sensing part(400). The socket guide is located at a lower part of the package pressing part and comprises a socket housing accommodation space in the center. The socket housing is accommodated in the socket housing accommodation space and comprises a socket that has a contactor. The stress sensing part is in contact with a bottom surface of the socket housing.
Bibliography:Application Number: KR20110082404