PHOTOSENSITIVE RESIN COMPOSITION AND LIGHT RECEIVING DEVICE

Disclosed is a photosensitive resin composition which is characterized by containing (A) an alkaline soluble resin, (B) a photopolymerization initiator and (D) an infrared absorbent that has a maximum absorption wavelength within the range of 800-2,500 nm (inclusive). The photosensitive resin compos...

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Bibliographic Details
Main Authors DEJIMA HIROHISA, TAKAHASHI TOYOSEI, SHIRAISHI FUMIHIRO, KAWATA MASAKAZU, YONEYAMA MASAHIRO
Format Patent
LanguageEnglish
Korean
Published 20.02.2013
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a photosensitive resin composition which is characterized by containing (A) an alkaline soluble resin, (B) a photopolymerization initiator and (D) an infrared absorbent that has a maximum absorption wavelength within the range of 800-2,500 nm (inclusive). The photosensitive resin composition is also characterized in that the maximum visible light transmittance at a wavelength of 400-700 nm (inclusive) is 5.0% or more. Also disclosed is a photosensitive resin composition which is characterized by containing (A) an alkaline soluble resin, (C) a photoacid generator and (D) an infrared absorbent that has a maximum absorption wavelength within the range of 800-2,500 nm (inclusive). The photosensitive resin composition is also characterized in that the maximum visible light transmittance at a wavelength of 400-700 nm (inclusive) is 5.0% or more.
Bibliography:Application Number: KR20127021590