HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES
PURPOSE: A high temperature resistance substrate coated with silver is provided to suppress oxidation of a nickel layer. CONSTITUTION: A high temperature resistance substrate coated with silver contains copper or a copper alloy, copper or a copper alloy-adjacent nickel layer, a nickel layer-adjacent...
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Main Authors | , , |
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Format | Patent |
Language | English Korean |
Published |
05.02.2013
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A high temperature resistance substrate coated with silver is provided to suppress oxidation of a nickel layer. CONSTITUTION: A high temperature resistance substrate coated with silver contains copper or a copper alloy, copper or a copper alloy-adjacent nickel layer, a nickel layer-adjacent tin layer, and a tin layer-adjacent silver layer. A method for manufacturing the silver-coated substrate comprises: a step of providing a substrate containing copper or a copper alloy; a step of precipitating a nickel layer adjacently to the copper or the copper alloy; a step of precipitating a tin layer adjacently to the nickel layer; and a step of precipitating a silver layer adjacently to the tin layer. |
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Bibliography: | Application Number: KR20120081892 |