HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES

• Main Authors: CLAUSS MARGIT, ZHANG BEGLINGER WAN, TOBEN MICHAEL P
• Format: Patent
• Language: English; Korean
• Published: 05.02.2013
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; TRANSPORTING

PURPOSE: A high temperature resistance substrate coated with silver is provided to suppress oxidation of a nickel layer. CONSTITUTION: A high temperature resistance substrate coated with silver contains copper or a copper alloy, copper or a copper alloy-adjacent nickel layer, a nickel layer-adjacent tin layer, and a tin layer-adjacent silver layer. A method for manufacturing the silver-coated substrate comprises: a step of providing a substrate containing copper or a copper alloy; a step of precipitating a nickel layer adjacently to the copper or the copper alloy; a step of precipitating a tin layer adjacently to the nickel layer; and a step of precipitating a silver layer adjacently to the tin layer.