LOW STRESS CAVITY PACKAGE FOR BACK SIDE ILLUMINATED IMAGE SENSOR, AND METHOD OF MAKING SAME

PURPOSE: A low stress cavity package for a rear illumination image sensor and a manufacturing method thereof are provided to prevent metal diffusion to a crystal handler by forming a metal layer on dielectric materials after the dielectric materials are formed. CONSTITUTION: An optical detector(14)...

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Bibliographic Details
Main Author OGANESIAN VAGE
Format Patent
LanguageEnglish
Korean
Published 29.01.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A low stress cavity package for a rear illumination image sensor and a manufacturing method thereof are provided to prevent metal diffusion to a crystal handler by forming a metal layer on dielectric materials after the dielectric materials are formed. CONSTITUTION: An optical detector(14) and a contact pad(16) are formed on the lower surface of a substrate(12). Bonding materials(20) are interposed between a handler(18) and the substrate. A color filter(22) and a microlens(24) are mounted on the rear of the substrate. The inside of the cavity is filled with a compliment dielectric material(32). An electrical wire is formed in a metal layer(36) and transmits signals from the contact pads to a BGA wire(42).
Bibliography:Application Number: KR20120078161