PLATING APPARATUS AND PLATING METHOD

PURPOSE: A plating apparatus and plating method are provided to remove a separate power device to rotate a substrate holder by rotating a substrate holder using a substrate holder transfer part for transferring a substrate holder to a plating part. CONSTITUTION: A plating apparatus includes a platin...

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Bibliographic Details
Main Author MINAMI YOSHIO
Format Patent
LanguageEnglish
Korean
Published 29.01.2013
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PURPOSE: A plating apparatus and plating method are provided to remove a separate power device to rotate a substrate holder by rotating a substrate holder using a substrate holder transfer part for transferring a substrate holder to a plating part. CONSTITUTION: A plating apparatus includes a plating part(130), a substrate holder, a substrate holder transferring part(140), a stoker(150) and a stoker configuring part. The plating part plates a substrate. The substrate holder holds a substrate. The substrate transferring part holds and transfers the substrate holder. The stoker stores the substrate holder. The stoker configuring part stores the stoker inside. The stoker includes a traveling mechanism for moving the stoker to inside of the stoker configuring part or from the stoker configuring part. The traveling mechanism includes a castor for moving or separating the stoker from the plating apparatus.
Bibliography:Application Number: KR20120025532