3D INTEGRATION MICROELECTRONIC ASSEMBLY FOR INTEGRATED CIRCUIT DEVICES AND METHOD OF MAKING SAME

PURPOSE: A three dimensional integrated microelectronic assembly for an integrated circuit device and a manufacturing method thereof are provided to reduce mechanical stress by matching thermal and mechanical properties of a dielectric material with thermal and mechanical properties of a PCB on whic...

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Bibliographic Details
Main Author OGANESIAN VAGE
Format Patent
LanguageEnglish
Korean
Published 20.12.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A three dimensional integrated microelectronic assembly for an integrated circuit device and a manufacturing method thereof are provided to reduce mechanical stress by matching thermal and mechanical properties of a dielectric material with thermal and mechanical properties of a PCB on which an interposer is mounted. CONSTITUTION: A three dimensional interposer(36) comprises a crystallization substrate handler(10). The crystallization substrate handler comprises a first surface and a second surface. A cavity is included within the first surface. A layer is formed with an insulating material which is prepared in a surface defining the cavity of the handler. The cavity is filled with a compliant dielectric material(18). A plurality of electrical circuits are formed through the interposer. Each electrical circuit comprises a first hole, a second hole, a layer, and a conductive material.
Bibliography:Application Number: KR20120060535