LIGHT EMITTING DIODE PACKAGE

PURPOSE: A light-emitting diode package is provided to improve photonic efficiency by forming guard steps on an incline of a package body and forming a transparency mold layer and a fluorescent substance layer into a dome structure. CONSTITUTION: A light emitting diode is formed on a base material....

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Bibliographic Details
Main Authors PARK, GWUI YOUN, YU, DONG HYUN, CHOI, JAE JIN, JUN, DUK JIN, KIM, GEUN HWAN
Format Patent
LanguageEnglish
Korean
Published 17.10.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A light-emitting diode package is provided to improve photonic efficiency by forming guard steps on an incline of a package body and forming a transparency mold layer and a fluorescent substance layer into a dome structure. CONSTITUTION: A light emitting diode is formed on a base material. A package body(120) is formed into a well structure along both edge parts of the base substrate. A mold layer(200) and a fluorescent substance layer(300) are successively laminated on the light emitting diode. An incline is formed along the inner surface of a partition wall of the package body. A first guard step divides the mold layer and the fluorescent substance layer. A second guard step prevents overflow of the fluorescent substance layer. The mold layer and the fluorescent substance layer are formed into a dome structure.
Bibliography:Application Number: KR20110032237