MULTILAYER PRINTED WIRING BOARD

Provides an IC chip for high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3GHz is exceeded. Conductive layer 34P on core substrate 30 is formed in the thickness of 30µm and a conductor circuit 58 on interlayer resin insulation layer 50 is formed...

Full description

Saved in:
Bibliographic Details
Main Authors SANO KATSUYUKI, INAGAKI YASUSHI
Format Patent
LanguageEnglish
Korean
Published 21.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Provides an IC chip for high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3GHz is exceeded. Conductive layer 34P on core substrate 30 is formed in the thickness of 30µm and a conductor circuit 58 on interlayer resin insulation layer 50 is formed in the thickness of 15µm. By thickening the conductive layer 34P, the volume of the conductor can be increased and resistance can be reduced. Further, by using the conductive layer 34 as a power source layer, the capacity of supply of power to an IC chip can be improved.
Bibliography:Application Number: KR20127022663