CURING AGENT FOR LOW TEMPERATURE CURE APPLICATIONS

• Main Authors: WALKER FREDERICK HERBERT, VEDAGE GAMINI ANANDA, LUCAS PETER ANDREW, COOK MICHAEL IAN, RASING ROBERT MARJO THEODOOR
• Format: Patent
• Language: English; Korean
• Published: 21.09.2012
• Subjects: ACYCLIC OR CARBOCYCLIC COMPOUNDS; CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PURPOSE: A hardener for low temperature curing and an amine-epoxy composition including the same are provided to provide excellent anti-corrosive, surface appearance and flexibility in curing at low temperature and coating at room temperature. CONSTITUTION: A hardener for low temperature curing comprises N,N'-dimethyl-meta-xylylenediamine, one or more polyfunctional amine having three or more active amine hydrogen, and one or more plasticizer or solvent. The amount of N,N'-dimethyl-meta-xylylenediamine is equivalent to or greater than one or more of the polyfunctional amines. The weight ratio of N,N'-dimethyl-meta-xylylenediamine to one or more of the polyfunctional amines is in a range of 55:45-90:10. The amine - epoxy composite comprises an amine curing agent composition and an epoxy component which includes the polyfunctional epoxy resin.