ANISOTROPIC CONDUCTIVE FILM, METHOD OF MANUFACTURING ANISOTROPIC CONDUCTIVE FILM, CONNECTING METHOD OF ELECTRONIC COMPONENT, ANISOTROPIC CONDUCTIVE CONNECTED STRUCTURE

PURPOSE: An anisotropic conductive film, a manufacturing method thereof, a connecting method of an electronic component, and an anisotropic conductive connection body are provided to form a multi-layered structure by placing the anisotropic conductive film between a chip component and an electrode p...

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Bibliographic Details
Main Author SAKURAI SHIGEKI
Format Patent
LanguageEnglish
Korean
Published 17.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
LINE CONNECTORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An anisotropic conductive film, a manufacturing method thereof, a connecting method of an electronic component, and an anisotropic conductive connection body are provided to form a multi-layered structure by placing the anisotropic conductive film between a chip component and an electrode part of a substrate. CONSTITUTION: An anisotropic conductive film(1) comprises a conductive particle containing layer, an insulation resin layer, and an elastic spacer(4). A chip component is mounted in an electrode part(11). The insulation resin layer contains a film forming resin, a thermosetting resin, a curing agent, and a conductive particle. The elastic spacer is placed on the border of the conductive particle containing layer and the insulation resin layer. A bump(13) is connected to the electrode part of a substrate.
Bibliography:Application Number: KR20120021971