BOARD INSPECTION METHOD

• Main Author: YOO, BYUNG MIN
• Format: Patent
• Language: English; Korean
• Published: 12.09.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; PRINTED CIRCUITS; TESTING

PURPOSE: A substrate inspecting method is provided to measure an offset caused by a transparent layer even though the transparent layer is formed around a measurement object, thereby obtaining a height map of a measurement object. CONSTITUTION: A substrate inspecting method is as follows. A transparent layer having an opening is formed and measurement data is obtained by irradiating light on a substrate where the measurement is formed in the opening(S110). An area of the measurement object is extracted from the measurement data(S120). A base area with respect to the measurement object is extracted from the measurement data(S130). The height of the measurement object is obtained based on measurement data of the base area and the area of the measurement object(S140). A height measurement offset caused by the transparent layer is obtained(S150). A height map of the measurement object is obtained based the height of the measurement object and the height measurement offset(S160). [Reference numerals] (AA) Start; (BB) Finish; (S110) Obtaining measurement data; (S120) Extracting a solder area; (S130) Extracting a base area; (S140) Obtaining the preliminary height of a solder; (S150) Obtaining an offset for height measurement; (S160) Obtaining a height map of a solder