MANUFACTURING METHOD FOR CERAMIC SUBSTRATE FOR PROBE CARD

PURPOSE: A method for manufacturing a ceramic substrate for a probe card is provided to manufacture the probe card with a simple process without restriction of circuit configuration and wafer type. CONSTITUTION: A first ceramic substrate(10) in which a plurality of common vias(20) is formed is prepa...

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Bibliographic Details
Main Authors CHANG, BYEUNG GYU, LEE, TAEK JUNG
Format Patent
LanguageEnglish
Korean
Published 22.08.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PURPOSE: A method for manufacturing a ceramic substrate for a probe card is provided to manufacture the probe card with a simple process without restriction of circuit configuration and wafer type. CONSTITUTION: A first ceramic substrate(10) in which a plurality of common vias(20) is formed is prepared. A first ceramic layer(30) and a second ceramic layer(40) are respectively laminated on the upper surface and lower surface of the first ceramic substrate. The first ceramic substrate, the first ceramic layer, and the second ceramic layer are plasticized at the same time. A via hole is formed on the first ceramic layer and the second ceramic layer. A wiring via(50) is formed by filling the via hole with conductive material.
Bibliography:Application Number: KR20110012847