CMP POROUS PAD WITH COMPONENT-FILLED PORES

This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.

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Bibliographic Details
Main Author PRASAD ABANESHWAR
Format Patent
LanguageEnglish
Korean
Published 07.08.2012
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.
Bibliography:Application Number: KR20127016015