PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME

• Main Author: SHIN, SEUNG YUL
• Format: Patent
• Language: English; Korean
• Published: 07.08.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to freely design the printed circuit board by implementing a method and a structure of manufacturing an embedded printed circuit board which directly connects internal components and the printed circuit board. CONSTITUTION: A first insulating layer(111) includes electric components(107,110). A first circuit pattern(116) is electrically connected to the electric components. A first planting connection section(117) is electrically connected to the first circuit pattern. A second insulating layer(118) includes the first circuit pattern and the first planting connection section. A second circuit pattern(122) is electrically connected to the first circuit pattern by a first connection section(124).