COOLING DEVICE FOR DIAMOND-WIRE CUTTING SYSTEM

PURPOSE: A cooling device for a diamond-wire cutting system is provided to prevent a spattering of the cooling fluid and cut chips and to improve dust removing effect because a hard brittle workpiece is always cut inside the cooling fluid. CONSTITUTION: A cooling device for a diamond-wire cutting sy...

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Bibliographic Details
Main Authors LEE PING FENG, LEE CHENG MING
Format Patent
LanguageEnglish
Korean
Published 10.07.2012
Subjects
BASIC ELECTRIC ELEMENTS
BROACHING
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
FILING
GRINDING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PLANING
POLISHING
SAWING
SCRAPING
SEMICONDUCTOR DEVICES
SHEARING
SLOTTING
TRANSPORTING
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Summary:PURPOSE: A cooling device for a diamond-wire cutting system is provided to prevent a spattering of the cooling fluid and cut chips and to improve dust removing effect because a hard brittle workpiece is always cut inside the cooling fluid. CONSTITUTION: A cooling device for a diamond-wire cutting system comprises a fluid retarding space for temporally containing cooling fluid. A cut portion of a diamond-wire(1) of a cooling system is dipped in the cooling fluid by penetrating through the fluid retarding space. The fluid retarding space is enclosed by a continuous side.
Bibliography:Application Number: KR20110022286