METHOD FOR MANUFACTURING CU WIRE PLATED PD

PURPOSE: A method for manufacturing a copper wire plated with palladium is provided to implement plating at relatively low current density by repetitively inserting and taking a copper wire in and out of a palladium plating bath. CONSTITUTION: A method for manufacturing a copper wire plated with pal...

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Bibliographic Details
Main Authors CHOI, YOUNG HEE, YOU, SUNG KUN, LEE, HA NA, HWANG, HWA IEK
Format Patent
LanguageEnglish
Korean
Published 05.07.2012
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PURPOSE: A method for manufacturing a copper wire plated with palladium is provided to implement plating at relatively low current density by repetitively inserting and taking a copper wire in and out of a palladium plating bath. CONSTITUTION: A method for manufacturing a copper wire plated with palladium comprises the steps of: preparing a copper wire(S10), dipping the copper wire in a palladium plating bath(S30), and performing palladium plating on the top of the copper wire through pulse-reverse electroplating comprising a forward current period of 1-100msec and an off current period of 0.1-10msec.
Bibliography:Application Number: KR20100135820