AUTOMATIC CLEANING APPARATUS OF EJECT PIN FOR WIRE BONDING OF LED PACKAGE

PURPOSE: An automatic cleaning apparatus of an eject pin for die bonding of an led package is provided to minimize the loss of a die-bonding process by regularly contacting an eject cap and an eject pin to a cleaning brush and a cleaning pad and cleaning the eject cap and the eject pin. CONSTITUTION...

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Bibliographic Details
Main Author LEE, BYONG HO
Format Patent
LanguageEnglish
Korean
Published 02.07.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An automatic cleaning apparatus of an eject pin for die bonding of an led package is provided to minimize the loss of a die-bonding process by regularly contacting an eject cap and an eject pin to a cleaning brush and a cleaning pad and cleaning the eject cap and the eject pin. CONSTITUTION: A supporting part(140) is supported by working equipment for die bonding. A rotational plate(110) rotates a cleaning brush(120) attached to a lower surface. The cleaning brush is composed of a plurality of brush hairs attached to the lower surface of the rotational plate. The cleaning brush cleans upper sides of the eject cap and the eject pin. A cleaning pad(130) absorbs the impact of the eject pin.
Bibliography:Application Number: KR20100132812