ADHESIVE COMPOSITION, CONNECTION STRUCTURE, METHOD FOR PRODUCING CONNECTION STRUCTURE, AND USE OF ADHESIVE COMPOSITION
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adhesive composition contains (a) a thermoplastic resin, (b) a rad...
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| Main Authors | , , |
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| Format | Patent |
| Language | English Korean |
| Published |
27.06.2012
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adhesive composition contains (a) a thermoplastic resin, (b) a radical-polymerizable compound, and (c) a radical polymerization initiator, and (d) a vinyl compound containing a phosphoric acid group, wherein the radical-polymerizable compound (b) contains urethane (meth)acrylate having a critical surface tension of 20-40 mN/m. |
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| AbstractList | Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adhesive composition contains (a) a thermoplastic resin, (b) a radical-polymerizable compound, and (c) a radical polymerization initiator, and (d) a vinyl compound containing a phosphoric acid group, wherein the radical-polymerizable compound (b) contains urethane (meth)acrylate having a critical surface tension of 20-40 mN/m. |
| Author | KATOGI SHIGEKI KUDOU SUNAO IZAWA HIROYUKI |
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| Notes | Application Number: KR20117018210 |
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| PublicationDateYYYYMMDD | 2012-06-27 |
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| RelatedCompanies | HITACHI CHEMICAL COMPANY, LTD |
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| Snippet | Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit... |
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| SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES |
| Title | ADHESIVE COMPOSITION, CONNECTION STRUCTURE, METHOD FOR PRODUCING CONNECTION STRUCTURE, AND USE OF ADHESIVE COMPOSITION |
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