ADHESIVE COMPOSITION, CONNECTION STRUCTURE, METHOD FOR PRODUCING CONNECTION STRUCTURE, AND USE OF ADHESIVE COMPOSITION

Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adhesive composition contains (a) a thermoplastic resin, (b) a rad...

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Bibliographic Details
Main Authors KUDOU SUNAO, IZAWA HIROYUKI, KATOGI SHIGEKI
Format Patent
LanguageEnglish
Korean
Published 27.06.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
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Summary:Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adhesive composition contains (a) a thermoplastic resin, (b) a radical-polymerizable compound, and (c) a radical polymerization initiator, and (d) a vinyl compound containing a phosphoric acid group, wherein the radical-polymerizable compound (b) contains urethane (meth)acrylate having a critical surface tension of 20-40 mN/m.
Bibliography:Application Number: KR20117018210