METHOD OF ELECTROPLATING UNIFORM COPPER LAYERS

PURPOSE: A method for electroplating a uniform copper layer is provided to uniformly deposit copper on the knee and wall of a through hole by adding a leveler in a copper electroplating composition. CONSTITUTION: A method for electroplating a uniform copper layer comprises the steps of: preparing an...

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Bibliographic Details
Main Authors NAJJAR ELIE H, BARSTAD LEON R, TOBEN MICHAEL P, LEFEBVRE MARK
Format Patent
LanguageEnglish
Korean
Published 25.06.2012
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A method for electroplating a uniform copper layer is provided to uniformly deposit copper on the knee and wall of a through hole by adding a leveler in a copper electroplating composition. CONSTITUTION: A method for electroplating a uniform copper layer comprises the steps of: preparing an electroplating composition which comprises one or more copper ion sources, 5-100ppb of 3-mercapto propane sulphonic acid, salt thereof or a mixture thereof, one or more additional brighteners, and one or more levelers, dipping a substrate with through holes in the electroplating composition, coating the walls and knees of the through holes with a first copper layer, and electroplating a uniform second copper layer on the first copper layer of the walls and knees of the through holes.
Bibliography:Application Number: KR20110135733