METHOD OF ELECTROPLATING UNIFORM COPPER LAYERS
PURPOSE: A method for electroplating a uniform copper layer is provided to uniformly deposit copper on the knee and wall of a through hole by adding a leveler in a copper electroplating composition. CONSTITUTION: A method for electroplating a uniform copper layer comprises the steps of: preparing an...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
25.06.2012
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A method for electroplating a uniform copper layer is provided to uniformly deposit copper on the knee and wall of a through hole by adding a leveler in a copper electroplating composition. CONSTITUTION: A method for electroplating a uniform copper layer comprises the steps of: preparing an electroplating composition which comprises one or more copper ion sources, 5-100ppb of 3-mercapto propane sulphonic acid, salt thereof or a mixture thereof, one or more additional brighteners, and one or more levelers, dipping a substrate with through holes in the electroplating composition, coating the walls and knees of the through holes with a first copper layer, and electroplating a uniform second copper layer on the first copper layer of the walls and knees of the through holes. |
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Bibliography: | Application Number: KR20110135733 |