The printed circuit board and the method for manufacturing the same

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to obtain excellent solder joint characteristics by controlling phosphorus content within a nickel alloy layer less than 5% and controlling the formation of a P-rich layer. CONSTITUTION: A plurality of base pads(120) is...

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Bibliographic Details
Main Authors PARK, CHANG HWA, KIM, AE RIM
Format Patent
LanguageEnglish
Korean
Published 05.06.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: A printed circuit board and a manufacturing method thereof are provided to obtain excellent solder joint characteristics by controlling phosphorus content within a nickel alloy layer less than 5% and controlling the formation of a P-rich layer. CONSTITUTION: A plurality of base pads(120) is formed on an insulating plate(110). The plurality of base pads is connected with a plurality of circuit patterns(125). The plurality of circuit patterns and the plurality of base pads are composed of conductive material. A first metal layer(130) is formed on the plurality of circuit patterns and the plurality of base pads. The first metal layer includes nickel. A second metal layer(140) is formed on the first metal layer. The second metal layer includes palladium. A third method layer(150) is formed on the second metal layer. The third method layer includes gold.
Bibliography:Application Number: KR20100102121