A METHOD OF ENCAPSULATING A FLEXIBLE OPTOELECTRONIC MULTI-LAYERED STRUCTURE

The invention relates to a method of encapsulating a flexible optoelectronic multi-layered structure (6) provided on a polymer substrate (2) comprising the steps of providing the flexible optoelectronic multi-layered structure with one or both a bottom encapsulation stack (B) and a top encapsulation...

Full description

Saved in:
Bibliographic Details
Main Authors VAN MOL ANTONIUS MARIA BERNARDUS, VAN DE WEIJER PETER, TANASE CRISTINA
Format Patent
LanguageEnglish
Korean
Published 03.05.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The invention relates to a method of encapsulating a flexible optoelectronic multi-layered structure (6) provided on a polymer substrate (2) comprising the steps of providing the flexible optoelectronic multi-layered structure with one or both a bottom encapsulation stack (B) and a top encapsulation stack (T), wherein the bottom encapsulation stack and the top encapsulation layer comprise a first inorganic layer (4a, 8a) separated from a second inorganic layer (4b, 8b) by a substantially continuous getter layer (5, 8) comprising a metal oxide, the first and the second inorganic layers having an intrinsic water vapour transmission of 10 -5 g.m -2 .day -1 or less.
Bibliography:Application Number: KR20127003505