METHOD OF FABRICATING CAPACITOR AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING THE SAME

PURPOSE: A manufacturing method of a capacitor and a manufacturing method of a semiconductor device including the same are provided to improve capacitance of the capacitor by forming a bottom electrode wider than a preliminary bottom electrode through ion implantation using boron or arsenic. CONSTIT...

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Main Authors LEE, YONG JAE, LIM, HAN JIN, IM, KI VIN, SEO, JONG BOM, KIM, BONG HYUN, NAM, SEOK WOO
Format Patent
LanguageEnglish
Korean
Published 02.05.2012
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Abstract PURPOSE: A manufacturing method of a capacitor and a manufacturing method of a semiconductor device including the same are provided to improve capacitance of the capacitor by forming a bottom electrode wider than a preliminary bottom electrode through ion implantation using boron or arsenic. CONSTITUTION: A gate insulating layer(102) is formed on a substrate(100). A first interlayer insulating film(112) is formed on the gate insulating layer. A second interlayer insulating film(118) is formed on the first interlayer insulating film. A preliminary bottom electrode(130) having a first area is formed on the substrate. A bottom electrode(132) having a second area which is wider than the first area is formed by ion-implanting on the preliminary bottom electrode. A dielectric film and a top electrode are formed on the bottom electrode. A bit line is electrically connected with a first impurity area. A capacitor is electrically connected with a second impurity area.
AbstractList PURPOSE: A manufacturing method of a capacitor and a manufacturing method of a semiconductor device including the same are provided to improve capacitance of the capacitor by forming a bottom electrode wider than a preliminary bottom electrode through ion implantation using boron or arsenic. CONSTITUTION: A gate insulating layer(102) is formed on a substrate(100). A first interlayer insulating film(112) is formed on the gate insulating layer. A second interlayer insulating film(118) is formed on the first interlayer insulating film. A preliminary bottom electrode(130) having a first area is formed on the substrate. A bottom electrode(132) having a second area which is wider than the first area is formed by ion-implanting on the preliminary bottom electrode. A dielectric film and a top electrode are formed on the bottom electrode. A bit line is electrically connected with a first impurity area. A capacitor is electrically connected with a second impurity area.
Author IM, KI VIN
KIM, BONG HYUN
LIM, HAN JIN
SEO, JONG BOM
LEE, YONG JAE
NAM, SEOK WOO
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– fullname: NAM, SEOK WOO
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Snippet PURPOSE: A manufacturing method of a capacitor and a manufacturing method of a semiconductor device including the same are provided to improve capacitance of...
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Title METHOD OF FABRICATING CAPACITOR AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING THE SAME
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