SEMICONDUCTOR PACKAGE

PURPOSE: A semiconductor package is provided to easily ground a shielding case by using a ground layer formed in the upper side of an electric component and protect internal elements from shocks. CONSTITUTION: One or more electric components(16) are mounted in the upper side of a substrate(11). A gr...

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Bibliographic Details
Main Author CHOI, SOO KI
Format Patent
LanguageEnglish
Korean
Published 25.04.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A semiconductor package is provided to easily ground a shielding case by using a ground layer formed in the upper side of an electric component and protect internal elements from shocks. CONSTITUTION: One or more electric components(16) are mounted in the upper side of a substrate(11). A ground layer(161) is formed on upper side of the electric component. The ground layer is formed by a metal case included in order to cover the upper side and side of the electric component. A shielding case(15) of conductive type accepts the electric component in inside. A conductive layer(19) electrically interlinks the electric component and the shielding case. The conductive layer is formed by conductive adhesive. A mold part(14) is placed between the substrate and the shielding case and seals the electric component.
Bibliography:Application Number: KR20100101000