APPARATUS AND METHOD FOR MONITORING LASER PROCESSING STATUS USING PLASMA

PURPOSE: Laser processing condition monitoring apparatus and method using plasma are provided to effectively monitor and analyze the processed condition of objects using the plasma generated from the processed objects. CONSTITUTION: A laser processing condition monitoring method comprises the follow...

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Bibliographic Details
Main Authors KIM, YUN SEOK, HAN, SEUNG HWOI, KIM, SEUNG MAN, KIM, YOUNG JIN, KIM, SEUNG WOO, YOO, JOON HO, PARK, SANG UK
Format Patent
LanguageEnglish
Korean
Published 25.04.2012
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DEVICES USING STIMULATED EMISSION
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MACHINE TOOLS
MEASURING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PHYSICS
SOLDERING OR UNSOLDERING
TESTING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: Laser processing condition monitoring apparatus and method using plasma are provided to effectively monitor and analyze the processed condition of objects using the plasma generated from the processed objects. CONSTITUTION: A laser processing condition monitoring method comprises the following steps: irradiating an object(102) with a pulse laser(107) for processing; and detecting light(200) transmitted from the plasma(106) generated from the object for monitoring the processed condition of the object. The peak power of the pulse laser is controlled to process the object with a nonlinear optic phenomenon.
Bibliography:Application Number: KR20100100780