LIGHT EMITTING DEVICE PACKAGE

PURPOSE: A light emitting device package is provided to improve heat radiation function by forming a bending unit on a lead frame and multiplying volume of the lead frame. CONSTITUTION: A body(110) comprises a cavity and a wall(120). First and second lead frames(140, 150) are mounted in the body. A...

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Bibliographic Details
Main Authors KIM, SUNG HO, CHOI, JUNG KI
Format Patent
LanguageEnglish
Korean
Published 19.04.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A light emitting device package is provided to improve heat radiation function by forming a bending unit on a lead frame and multiplying volume of the lead frame. CONSTITUTION: A body(110) comprises a cavity and a wall(120). First and second lead frames(140, 150) are mounted in the body. A light source unit(130) is electrically connected to the first and second lead frames. A heat radiation unit is connected to one of the first and second lead frames. The heat radiation unit is formed within the body. The heat radiation unit comprises a rounding unit and one or more depression units. The depression unit is formed on the lower surface of the heat radiation unit. A resin layer is formed in the depression unit. One of the first and second lead frames comprises one or more bending units.
Bibliography:Application Number: KR20100098920