SEMICONDUCTOR PACKAGE WITH A DAM THAT DEFINES THE AREA FORMING PROTECTIVE LAYER

PURPOSE: A semiconductor package equipped with a dam is provided to prevent the damage of a semiconductor chip by eliminating constant resistance between the semiconductor chip and a heat radiation plate touched to the top of a protection layer. CONSTITUTION: A dam(110) is formed on a package substr...

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Bibliographic Details
Main Authors HWANG, HEE JUNG, CHOI, MI NA, CHO, EUN SEOK, BAE, SE RAN
Format Patent
LanguageEnglish
Korean
Published 18.04.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A semiconductor package equipped with a dam is provided to prevent the damage of a semiconductor chip by eliminating constant resistance between the semiconductor chip and a heat radiation plate touched to the top of a protection layer. CONSTITUTION: A dam(110) is formed on a package substrate(170). The dam is formed in order to completely surround a semiconductor chip(150). The semiconductor chip is formed on the package substrate. A protective layer(130) is formed within a protective layer formation region of the package substrate. The protective layer absorbs heat created in the semiconductor chip and releases the heat. A heat radiation plate(190) is close with the protective layer. The dam comprises a plurality of sub dams. The plurality of sub dams is separately arranged around the semiconductor chip.
Bibliography:Application Number: KR20100098280